70-3205-1810

Solder

Manufacturer No:
70-3205-1810
Manufacture:
Kester Solder
Datasheet:
70-3205-1810
Description:
SOLDER PASTE NXG1 NO CLEAN 500GM

In Stock

0 pcs On sales

$109.6

Product Parameter

Diameter
-
Flux Type
No-Clean
Shelf Life
8 Months
Wire Gauge
-
Composition
Sn99.3Cu0.7 (99.3/0.7)
Part Status
Active
Melting Point
441°F (227°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Form
Jar, 17.64 oz (500g)
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Series
NXG1
Process
Lead Free

Company Profile

Atlaschip is a globally authorized distributor of semiconductors and electronic components ,IC ,COF/ TAB ,Opencell for over 600 industry-leading manufacturer brands. a key resource for design engineers. We are guides innovation forward for the global leading technology manufacturers and service providers.

70-3205-1810 Relevant information

70-3-25
70-3-25

DESOLDER BRAID UNFLUX 0.08" 25'

70-3205-0819
70-3205-0819

SOLDER PASTE NXG1 NO CLEAN 750GM

70-3205-1810
70-3205-1810

SOLDER PASTE NXG1 NO CLEAN 500GM

70-3205-1812
70-3205-1812

SOLDER PASTE NXG1 NO CLEAN 1000G

70-3213-0810
70-3213-0810

SOLDER PASTE NXG1 NO CLEAN 500GM

70-3213-0811
70-3213-0811

SOLDER PASTE NXG1 NO CLEAN 600GM