BDN15-3CB/A01
Thermal - Heat Sinks
- Manufacturer No:
- BDN15-3CB/A01
- Manufacture:
- CTS Thermal Management Products
- Datasheet:
- BDN15-3CB/A01
- Description:
- HEATSINK CPU W/ADHESIVE 1.51"SQ
In Stock
0 pcs On sales
$2.1
Product Parameter
- Part Status
- Active
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Material Finish
- Black Anodized
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Thermal Resistance @ Natural
- 15.10°C/W
- Type
- Top Mount
- Height Off Base (Height of Fin)
- 0.355" (9.02mm)
- Shape
- Square, Pin Fins
- Power Dissipation @ Temperature Rise
- -
- Width
- 1.510" (38.35mm)
- Thermal Resistance @ Forced Air Flow
- 4.50°C/W @ 400 LFM
- Length
- 1.510" (38.35mm)
- Series
- BDN
- Diameter
- -
- Material
- Aluminum
Company Profile
Atlaschip is a globally authorized distributor of semiconductors and electronic components ,IC ,COF/ TAB ,Opencell for over 600 industry-leading manufacturer brands. a key resource for design engineers. We are guides innovation forward for the global leading technology manufacturers and service providers.
BDN15-3CB/A01 Relevant information
BDN10-5CB/A01
HEATSINK CPU W/ADHESIVE 1.01"SQ
BDN15-3CB/A01
HEATSINK CPU W/ADHESIVE 1.51"SQ