APF30-30-13CB

Thermal - Heat Sinks

Manufacturer No:
APF30-30-13CB
Manufacture:
CTS Thermal Management Products
Datasheet:
APF30-30-13CB
Description:
HEATSINK LOW-PROFILE FORGED

In Stock

74 pcs On sales

$6.19

Product Parameter

Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Natural
-
Type
Top Mount
Height Off Base (Height of Fin)
0.500" (12.70mm)
Shape
Square, Fins
Power Dissipation @ Temperature Rise
-
Width
1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow
2.50°C/W @ 200 LFM
Length
1.181" (30.00mm)
Series
APF
Diameter
-
Material
Aluminum
Part Status
Active

Company Profile

Atlaschip is a globally authorized distributor of semiconductors and electronic components ,IC ,COF/ TAB ,Opencell for over 600 industry-leading manufacturer brands. a key resource for design engineers. We are guides innovation forward for the global leading technology manufacturers and service providers.

APF30-30-13CB Relevant information

APF30-30-13CB
APF30-30-13CB

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