630-60AB
Thermal - Heat Sinks
- Manufacturer No:
- 630-60AB
- Manufacture:
- Wakefield-Vette
- Datasheet:
- 630-60AB
- Description:
- HEATSINK FOR BGA 35MM
In Stock
0 pcs On sales
$1.2
Product Parameter
- Attachment Method
- Thermal Tape, Adhesive (Not Included)
- Thermal Resistance @ Natural
- -
- Type
- Top Mount
- Height Off Base (Height of Fin)
- 0.598" (15.20mm)
- Shape
- Square, Pin Fins
- Power Dissipation @ Temperature Rise
- -
- Width
- 1.378" (35.00mm)
- Thermal Resistance @ Forced Air Flow
- 3.00°C/W @ 350 LFM
- Length
- 1.378" (35.00mm)
- Series
- 630
- Diameter
- -
- Material
- Aluminum
- Part Status
- Active
- Package Cooled
- BGA
- Material Finish
- Black Anodized
Company Profile
Atlaschip is a globally authorized distributor of semiconductors and electronic components ,IC ,COF/ TAB ,Opencell for over 600 industry-leading manufacturer brands. a key resource for design engineers. We are guides innovation forward for the global leading technology manufacturers and service providers.
630-60AB Relevant information
630-009-640-033
CONN D-SUB RCPT 9POS R/A SOLDER
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