Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
LGA-16 STENCIL
Chip Quik, Inc.
SOIC-20 STENCIL
SOIC-24 STENCIL
QFN-44 STENCIL
POWERSOIC-8/PSOP-8/HSOP-8 STENCI
QFN-20 0.5 MM PITCH 4.0 X 4.0 MM
QFN-20 STENCIL
QFN-36 STENCIL
QFN-48 STENCIL
SSOP-20 STENCIL
PLCC-28/LCC-28/JLCC-28 STENCIL
QFN-16 STENCIL
QFN-28 STENCIL
QFN-40 STENCIL
SOLDER WIRE NO-CLEAN 63/37 1OZ.
SOLDER WIRE 63/37 TIN/LEAD ROSIN
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.