Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
QFN-14 STENCIL
Chip Quik, Inc.
MSOP-12 (0.65MM PITCH, 4X3MM BOD
QFN-12/LFCSP-12 (0.4MM PITCH, 2X
DFN-12 (0.4MM PITCH, 3X3MM BODY)
TSSOP-44 (0.64MM PITCH, 14X6.1MM
DFN-10 (0.4MM PITCH, 2X2MM BODY)
QFN-24/LFCSP-24 (0.5MM PITCH, 5X
DFN-22 (0.5MM PITCH, 6X3MM BODY)
MQFP-44 (0.8MM PITCH, 10X10MM BO
LGA-10 (0.65MM PITCH, 3X3MM BODY
SSOP-24 (1MM PITCH, 13X6MM BODY)
SOIC-32 (1.27MM PITCH, 20.4X11.3
DFN-8 (0.45MM PITCH, 2X3MM BODY)
SON-6 (0.65MM PITCH, 2X2MM BODY)
SOP-36 (0.65MM PITCH, 12.8X7.5MM
POWERPAD-16/POWERSOIC-16 (1.27MM
SOIC-44 (1.27MM PITCH, 28.1X13.2
BGA-24 (1MM PITCH, 8X6MM BODY) S
BGA-25 (1MM PITCH, 8X6MM BODY) S
DFN-8/MLP-8 (1.27MM PITCH, 6X8MM